India gets into act to solve chip crisis

Semiconductor design was a highly knowledge-intensive field and needed exceptionally skilled manpower and tools

PRAVASISAMWAD.COM

Reacting to the chip crisis in the country, the Indian government said it was well aware of the importance of semiconductor design and had a budgetary allocation of Rs 100 crore for chip design related programmes in this ongoing financial year. This was informed by Electronics and IT Minister Ashwini Vaishnaw in a written reply in the Rajya Sabha. Semiconductor design was a highly knowledge-intensive field and needed exceptionally skilled manpower and tools, he said.

India had a huge talent pool for semiconductor design and a high number of design patents and intellectual property rights (IPR) were produced in the country by design engineers. “The total budget allocation for chip design related activities / programmes in the current financial year is Rs 100 crore,” Vaishnaw said.

The government wanted to broaden the Electronics System Design and Manufacturing (ESDM) sector with semiconductor design as one of the focus areas. Currently, semiconductor wafer fabrication facilities for strategic requirements were available at SemiConductor Laboratory (SCL), Mohali; Gallium Arsenide Enabling Technology Centre (GAETEC), Hyderabad and Society for Integrated Circuit Technology and Applied Research (SITAR), Bengaluru, the minister said.

The government wanted to broaden the Electronics System Design and Manufacturing (ESDM) sector with semiconductor design as one of the focus areas

To push development of semiconductors, the government has approved ‘Establishment of Gallium Nitride (GaN) Ecosystem Enabling Centre and Incubator for High Power and High Frequency Electronics’. The project is being implemented by Society for Innovation and Development (SID) under the auspices of Indian Institute of Science (IISc) at Centre for Nano Science and Engineering (CeNSE), Bengaluru at the total project cost of Rs 298.66 crore.

“An application for setting up of Assembly, Testing, Marking and Packaging (ATMP) of NAND Flash memory has been approved under the Production Linked Incentive (PLI) Scheme for large scale electronics manufacturing,” the minister said.

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